Lantronix Inc., a global leader of compute and connectivity IoT solutions, has officially announced the launch of its powerful new System-in-Package (SiP) solutions.
According to certain reports, these solutions are powered by Qualcomm® Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.
More on the same would reveal how, by leveraging a combination of leading-edge performance and cost efficiency, Lantronix’s solutions effectively accelerate the development of AI-driven applications in industrial and enterprise use cases, including robotics, industrial automation, video surveillance, video collaboration and drones.
Not just that, using these solutions, Lantronix is also able to facilitate the creation of superior, high-performance AI-driven applications, doing so by integrating AI capabilities from the Qualcomm® AI Hub. You see, the stated Qualcomm AI Hub alone can provide a reference base of more than 100 AI models and a simplified model optimization process to efficiently utilize AI capabilities (3.5 to 100 INT-8 TOPS) in these SiP families.
Complimenting that is SiP modules’ bid to remain compliant with the Trade Agreements Act (TAA) and the National Defense Authorization Act (NDAA).
Talk about these new solutions on a slightly deeper level, we begin from Lantronix’s IQ9 Series SiPs for industrial and robotics applications. These models provide scalable, power-efficient, and robust computing to autonomous devices, and next-generation Industry 4.0 designs using advanced AI. Furthermore, they deliver robust safety functions in autonomous mobile robots (AMR) or platforms with functional safety (FuSa) up to level SIL-3 level (IQ-9100-based SiPs only).
Next up, the solutions in question leverage an integrated, dedicated safety island (IQ-9100) or real-time subsystem (IQ-9075) with four dedicated independent processing cores to supply fault tolerance Error Correction Code (ECC) memory support and system cost savings, thus bringing real-time operating systems for system error monitoring and other critical functions.
Lantronix IQ9 Series SiPs also bank upon powerful Qualcomm® Adreno™ 663 GPU and support for up to 16 concurrent cameras to optimize robot perception, navigation, and versatility.
Another detail worth a mention here is rooted in the modules’ interactive industrial edge AI systems that can utilize upto 100 TOPS. An example relaying their prowess could be how the IQ9 Series Hexagon tensor processor can achieve a generation rate of 12 tokens per second when running the Llama 2 13B parameter mode.
Beyond the IQ9 Series, Lantronix launched its Open-Q 8550CS modules for advanced video and AI applications. These particular modules arrive on the scene with an ability to provide high AI performance, power efficiency, and advanced Wi-Fi® 7 and Bluetooth® 5 connectivity, making them ideal for long-term, high-demand edge computing applications. Hence, they can be used to enhance video conferencing meeting experiences, automated guided vehicle pathing, smart camera image quality, and edge AI box scalability with the family’s octal-core computing capabilities and 48 AI TOPS tensor performance.
The Open-Q 8550CS modules can also banked upon for performing complex 3D rendering and computer vision tasks with a powerful Adreno 740 GPU supporting ray tracing, Open GL ES, Vulkan and Open CL profiles, and 4K240/8K60 video decoding and 4K120/8K30 encoding.
Rounding up highlights would be Lantronix’s Open-Q 6490CS and 5430CS modules that are meant to be used in conceiving scalable AI solutions. These modules allow customers to scale their product lines with minimal development effort, while simultaneously benefiting from low-power AI performance, Wi-Fi 6E and BLE 5+ connectivity. In essence, they include real-time machine learning on 6th-generation AI engine, delivering 3.5 to 13 AI TOPS. Joining the same is an octal-core CPU and Adreno 640 class GPU.
Then, there is also on the offer advanced multimedia and AI powered camera support, which is delivered through up to three concurrent ISPs.
“With the addition of these five new SiP solutions, we continue our strategic collaboration with Qualcomm Technologies that has enabled Lantronix to build a proven track record of successfully delivering integrated, collaborative solutions that are driving forward IoT and AI/ML technologies to meet the evolving needs of today’s advanced-edge applications,” said Mathi Gurusamy, chief strategy officer for Lantronix.
