High-density multilayer flexible circuit technology designed to support next-generation quantum computers
Denver, Colorado, 10 March 2026 – Amphenol Printed Circuits (APC) will participate as an exhibitor at the APS Global Physics Summit 2026, scheduled to take place from March 15 to March 20 in Denver, Colorado. During the event, the company will highlight its advanced printed circuit board technologies designed to support the rapidly growing field of quantum computing.
The APS Global Physics Summit, organized by the American Physical Society, is one of the world’s largest gatherings of physicists, researchers, and technology innovators. The event brings together experts from academia and industry to explore emerging breakthroughs in physics, advanced computing, and scientific research.
At the summit, APC will showcase its capabilities in rigid, flexible, and rigid-flex printed circuit boards. A key focus will be on high-density multilayer flexible circuits specifically developed for quantum computing systems.
Quantum computers require highly specialized hardware that can operate in extremely low temperatures, often reaching millikelvin cryogenic levels. In these environments, electronic components must maintain reliable signal performance while supporting complex circuit connections.
APC’s advanced circuit materials and flexible PCB technologies are designed to perform reliably under these demanding conditions. The company develops circuits that provide strong signal integrity, ensuring that data signals remain accurate and stable even in cryogenic quantum computing systems.
During the event, APC will demonstrate examples of low-layer-count multilayer flexible printed circuits capable of dense signal routing. These circuit designs help connect multiple components within quantum computing systems while maintaining compact and efficient layouts.
Dense circuit routing is particularly important in quantum computers, where precise interconnections and consistent performance are required to maintain system stability. APC’s flexible circuits are engineered to support these complex requirements while offering scalability for future quantum technologies.
The company also works closely with customers to design circuit layouts that meet the specific needs of quantum platforms. By offering different conductor options and customized design solutions, APC helps researchers and technology developers build reliable hardware for next-generation computing systems.
According to Brian Guidi, senior applications engineer and Flex/Rigid-Flex subject matter expert at APC, the evolution of quantum computing is driving new demands in electronic interconnect technologies.
He explained that quantum development requires a higher level of performance, consistency, and scalability from printed circuit boards and interconnect systems. APC’s experience in high-reliability sectors such as aerospace, defense, and radio frequency systems has helped the company develop solutions capable of supporting these advanced requirements.
As quantum computing moves beyond laboratory research and toward real-world applications, the need for reliable hardware infrastructure is becoming increasingly important. Technologies such as high-density PCBs, flexible circuits, and cryogenic-compatible materials play a critical role in enabling scalable quantum architectures.
Industry experts believe that innovations in circuit design and signal integrity will be essential for supporting future quantum processors used in fields such as advanced simulations, cryptography, artificial intelligence, and scientific research.
By participating in the APS Global Physics Summit 2026, APC aims to connect with researchers, engineers, and technology leaders working on next-generation computing platforms and quantum hardware development.
The company’s showcase highlights how advanced PCB technology is becoming an important building block in the rapidly evolving quantum computing ecosystem.
