Conceiving an Innovation Suite to Build Upon the Potential of Simulation

Ansys has officially announced a whole new assortment of solutions that are all designed to easily integrate with existing infrastructure to minimize disruption and let teams collaborate on more innovative products.

According to certain reports, all these products leverage the power of AI, cloud computing, GPUs, and HPC to ensure faster, collaborative decision-making, broader design exploration, and reduced product design timelines.

Talk about the given solutions on a slightly deeper level, we begin from Ansys Discovery, which would be the company’s 3D simulation software geared towards significantly expanding thermal modeling with electrothermal analysis, orthotropic conductivity, and internal fans, while simultaneously maintaining speed and ease of use.

Next up, we have a structural analysis suite in play. This particular suite can be expected to deliver a fully integrated solution for noise, vibration, harshness (NVH), delivering 10x faster frequency response function (FRF) calculator, vibro-acoustics mapping, optimized meshing, and mode contribution analysis.

Joining that would the introduction of Ansys Electronics technology, which can seamlessly connect with other Ansys software products to enable improved meshing. In case you weren’t aware, meshing is crucial for 3D integrated circuits, automated workflow capabilities, and boosted simulation performance.

Then, we have the Ansys Fluent® multi-GPU fluid simulation solver, which can now support applications with very high total mesh cell counts, such as automotive external aerodynamics. This makes it possible for designers to add more parameters to refine accuracy without compromising overall simulation speed.

“Ansys 2025 R1 offers more integration capabilities than ever, helping teams carve a digital path through the entire lifecycle of a product, with tools and solutions to help expertly manage data pre- and post-development,” said Shane Emswiler, senior vice president of products at Ansys. “This release highlights that our solutions can serve as guideposts, helping disconnected teams stay the course and work collaboratively from a single, accessible source of truth. This not only significantly cuts costs, but it also accelerates time-to-market,”

Another detail worth a mention here is rooted in the introduction of Ansys CFD HPC Ultimate. This happens to be a new product capable of providing enterprise-level CFD capabilities for one job on multiple CPU cores or GPUs without the need for added HPC licenses.

Ansys also took this opportunity to reveal new GPU-accelerated simulations in Ansys Lumerical FDTD™ advanced 3D electromagnetic simulation software, simulations that use 50% less GPU memory and provide a 20% reduction in meshing time compared to CPUs.

Up next, the company brought Ansys Mechanical™ GPU-accelerated direct structural finite element analysis solver, which is up to 6x faster than alternative solutions, whereas the iterative solver is 6x faster than CPU-only versions.

Beyond that, we have an Ansys Cloud Burst Compute with Discovery solution. The stated solution empowers designers to solve 1,000 design variations in 10 minutes. In fact, parametric studies in Discovery can be accelerated by 100x or more by leveraging NVIDIA GPUs.

Alongside that, Ansys customers can come expecting Ansys Cloud Burst Compute capability that provides elastic, flexible, on-demand HPC capacity for Ansys Mechanical, Fluent, and Ansys HFSS™ high-frequency electromagnetic simulation software.

Among other things, we ought to acknowledge how Ansys has developed an intuitive, interactive tool, designed to streamline data preparation for SimAI modeling. This SimAI model also paves the way for users to expand the training data for gaining further insight during post-processing, such as during honing analysis around a specific component within a larger design

In case that wasn’t enough, the company has also introduced Ansys Electronics AI+, which uses AI-driven techniques to predict resources and runtime for electronics simulations in Ansys Maxwell® advanced electromagnetic field solver, Ansys Icepak® electronics cooling simulation software, and HFSS.

“Ansys’ industry-leading simulation solutions will help drive Vertiv’s business model as we design solutions for the future,” said Steve Blackwell, vice president of engineering at Vertiv. “Our mission is to revolutionize the way the world conceptualizes and develops data centers — from cooling and power technologies through implementing AI in the design of the data center itself. With Ansys, we will more quickly meet critical milestones that will help us deliver the most optimal infrastructure to support our customers’ AI-based projects with energy-efficient and reliable future-forward designs.”

 

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